Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Making a plurality of integrated circuit packages

Making a plurality of integrated circuit packages

US Patent 9363901 · Granted Jun 7, 2016

Estimated economic value: $15,467,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Light guide plate used in keyboard2022
Leadframe with vertically spaced die attach pads2022
Method of making a wire support leadframe for a semiconductor device2020
Leadframe with vertically spaced die attach pads2020
Wire support for a leadframe2020
Method of making a wire support leadframe for a semiconductor device2019
Packaged semiconductor device having multi-level leadframes configured as module2019
Wire support for a leadframe2018
Semiconductor package having a leadframe with multi-level assembly pads2018
Planar leadframe substrate having a downset below within a die area2017
Device and method for measuring pitch and roll torques2017
Method of making a wire support leadframe for a semiconductor device2017