Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Vertical LED chip package on TSV carrier

Vertical LED chip package on TSV carrier

US Patent 9362474 · Granted Jun 7, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for dicing interposer assembly2019
Wafer level reflector for LED packaging2016
Package for three dimensional integrated circuit2016
Apparatus and methods for molding die on wafer interposers2016
Protected solder ball joints in wafer level chip-scale packaging2015
Apparatus for dicing interposer assembly2015
Vertical LED chip package on TSV carrier2014
Structures and formation methods of packages with heat sinks2014
Package for three dimensional integrated circuit2014
Tape residue-free bump area after wafer back grinding2014
Light-emitting diode (LED) package systems2014
Methods for de-bonding carriers2014