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Home › Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug

Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug

US Patent 9351081 · Granted May 24, 2016

Estimated economic value: $12,387,000 ⓘ

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