Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for mechanical stress enhancement in semiconductor devices

Method for mechanical stress enhancement in semiconductor devices

US Patent 9349655 · Granted May 24, 2016

Estimated economic value: $2,867,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including stress control layer and methods of forming the s2025
Semiconductor package and method of manufacture2025
Dicing process in packages comprising organic interposers2025
Semiconductor package and manufacturing method of the same2025
Package structure2025
Semiconductor package including stress buffers and methods of forming the same2025
Semiconductor device and method for forming the same2025
Semiconductor structure and manufacturing method thereof2025
Semiconductor device2025
Package structure with conductive patterns in a redistribution layer2025
Integrated fan-out package having stress release structure2025
Integrated passive device dies and methods of forming and placement of the same2025