Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method to improve strain rate control of small lead free printed circuit board assembly during in circuit test process

Method to improve strain rate control of small lead free printed circuit board assembly during in circuit test process

US Patent 9347984 · Granted May 24, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for retarder-to-oven dough product2019
Adding test access to a back-drilled VIA2018
Land grid array interconnect formed with discrete pads2017
Sensor-based removal of a soldered device2017
Component rework nozzle2016
Component rework nozzle2016
Dual side staggered surface mount dual in-line memory module2016
Method of forming a land grid array with discrete pads2014
Modified 0402 footprint for a printed circuit board (‘PCB’)2014
Implementing ultra high availability personality card2014
Apparatus, system, and method for reducing power consumption on devices with mul2011
Attachment of a QFN to a PCB2010