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Home › Cooling a secondary component by diverting airflow using an air channel associated with a thermal dissipation device that cools a primary component

Cooling a secondary component by diverting airflow using an air channel associated with a thermal dissipation device that cools a primary component

US Patent 9320159 · Granted Apr 19, 2016

Estimated economic value: $5,685,000 ⓘ

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