Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications

Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications

US Patent 9305806 · Granted Apr 5, 2016

Estimated economic value: $41,587,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Low dishing oxide CMP polishing compositions for shallow trench isolation applic2025
Low dishing oxide CMP polishing compositions for shallow trench isolation applic2025
Shared data induced quality control for a chemical mechanical planarization proc2025
High oxide film removal rate shallow trench (STI) chemical mechanical planarizat2024
High oxide film removal rate shallow trench (STI) chemical mechanical planarizat2024
Chemical mechanical planarization composition for polishing oxide materials and 2023
Low oxide trench dishing chemical mechanical polishing2023
Low oxide trench dishing chemical mechanical polishing2023
Low oxide trench dishing chemical mechanical polishing2023
Low oxide trench dishing chemical mechanical polishing2023
Tungsten chemical mechanical polishing for reduced oxide erosion2023
Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing2023