Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for flip chip packaging co-design

Method for flip chip packaging co-design

US Patent 9305131 · Granted Apr 5, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit configurable to perform adaptive thermal ceiling control in p2025
Adaptive thermal ceiling control system2024
Semiconductor package2018
Inverter and ring oscillator with high temperature sensitivity2018
Computer-implemented method of designing a modularized stacked integrated circui2018
Methods for distributing power in layout of IC2018
Semiconductor package2017
Microelectronic package with surface mounted passive element2017
Method for co-designing flip-chip and interposer2017
Method for co-designing flip-chip and interposer2017
Method and apparatus for flip chip packaging co-design and co-designed flip chip2017
Method and apparatus for flip chip packaging co-design and co-designed flip chip2017