Thiolate-bridged multinuclear copper(I) complex

Assignee

• Samsung
• National University Corporation Hokkaido University

Inventors

• Nobutaka Akashi (29 patents)
• Masako Kato (7 patents)
• Atsushi Kobayashi (371 patents)
• Kotaro SHIMADA (3 patents)
• Hiroki Ohara (149 patents)

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