Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › SOI wafer, manufacturing method therefor, and MEMS device

SOI wafer, manufacturing method therefor, and MEMS device

US Patent 9266715 · Granted Feb 23, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Azo compound, composition, film, laminate, and display device2025
Manufacturing method of a semiconductor pressure sensor having first silicon and2024
Semiconductor pressure sensor2021
Mirror driving apparatus and method for manufacturing thereof2020
Semiconductor pressure sensor2020
Semiconductor pressure sensor2020
Ceramic substrate and method for manufacturing the same2019
Semiconductor differential pressure sensor and manufacturing method of the same2019
Polymer compound and organic semiconductor device using the same2019
Antenna device2019
Tetracenothiophene derivatives with alkoxy-c-alkyne solubilising units and their2018
SOI wafer, manufacturing method therefor, and MEMS device2015