Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device including passivation layer encapsulant

Semiconductor device including passivation layer encapsulant

US Patent 9214385 · Granted Dec 15, 2015

Estimated economic value: $1,367,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Metal pad modification2023
Formation of terminal metallurgy on laminates and boards2021
Flip chip packaging rework2021
Integrated circuit tester probe contact liner2021
Bridge support structure2021
Carrier and integrated memory2021
Carrier and integrated memory2020
Finned contact2020
Integrated circuit tester probe contact liner2020
Final passivation for wafer level warpage and ULK stress reduction2020
Metal pad modification2020
Element place on laminates2020