Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ingot cutting method capable of reducing wafer damage percentage

Ingot cutting method capable of reducing wafer damage percentage

US Patent 9205572 · Granted Dec 8, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for detecting dehydration2019
Nanostructured chip and method of producing the same2018
Chip reducing thermal stress of current path thereon2018
Conjugate common optical path lithography lens2018
Substrate with high fracture strength2017
Personal hygiene item2017
Fluorescence excitation device and portable fluorescence analysis system with th2017
Optical components exposer set having non-spherical component2017
Wafer with high rupture resistance2016
Solar substrate with high fracture strength2016
Fluorescence strip, fluorescence excitation device and portable fluorescence ana2016
Liquid combination for dielectric liquid lens2015