Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Two-sided-access extended wafer-level ball grid array (eWLB) package, assembly and method

Two-sided-access extended wafer-level ball grid array (eWLB) package, assembly and method

US Patent 9177884 · Granted Nov 3, 2015

Estimated economic value: $65,628,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fast thin-film light emitting diode2016
Optical data communication module with sliding fiber clamp sleeve2015
Optical data communication module having EMI cage2015
Molded leadframe for PCB-to-PCB connection2015
User-configurable optical fiber link2015
Opto-isolator that uses a nontransparent hollow tube as the optical waveguide ex2014
Fiber optic transceiver module having a molded cover in which an optical beam tr2013
Source-multiplexed pulse amplitude modulation (PAM) optical data communication s2013
2-to-1 plastic optical fiber (POF) optical coupler, a bi-directional optical com2013
Half-duplex, single-fiber (S-F) optical transceiver module and method2012
2-to-1 optical coupler that utilizes D-shaped plastic optical fibers (POFs), a b2012
Interface arrangement for opto-electronic data transfer, and plug-in opto-electr2008