Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming electronic components with increased reliability

Method of forming electronic components with increased reliability

US Patent 9171836 · Granted Oct 27, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Devices and methods involving activation of buried dopants using ion implantatio2025
Integrated design for III-Nitride devices2025
Lateral III-nitride devices including a vertical gate module2025
Lateral III-nitride devices including a vertical gate module2025
III-N based material structures, methods, devices and circuit modules based on s2025
Method to control the relaxation of thick films on lattice-mismatched substrates2025
High mobility group-III nitride transistors with strained channels2024
Module configurations for integrated III-nitride devices2024
Module configurations for integrated III-nitride devices2024
N-polar devices including a depleting layer with improved conductivity2024
N-polar devices including a depleting layer with improved conductivity2024
Plush toy2024