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Home › Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features

Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features

US Patent 9165854 · Granted Oct 20, 2015

Estimated economic value: $6,386,000 ⓘ

Assignee

Qualcomm

Inventors

Dexter Tamio Chun (98 patents)
Victor A. Chiriac (24 patents)
James H. Thompson (16 patents)
Stephen Molloy (35 patents)

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