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Home › Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications

Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications

US Patent 9153863 · Granted Oct 6, 2015

Estimated economic value: $20,136,000 ⓘ

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