Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for forming conductive elements and vias on substrates and for forming multi-chip modules

Methods for forming conductive elements and vias on substrates and for forming multi-chip modules

US Patent 9153491 · Granted Oct 6, 2015

Estimated economic value: $10,070,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of forming curved image sensors2018
Microfeature workpieces having alloyed conductive structures, and associated met2017
Hermetic sealing of optical module2017
Methods for forming conductive elements and vias on substrates2014
Wafer processing2013
Method and apparatus for RFID communication2013
Method and apparatus for RFID communication2013
Method and apparatus for RFID communication2013
Methods of forming conductive vias through substrates, and structures and assemb2012
Method and apparatus for communicating with RFID devices coupled to a roll of fl2011
Method of manufacturing an enclosed transceiver2011
Wafer processing2011