Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Platen for wafer polishing having diamond-ceramic composites

Platen for wafer polishing having diamond-ceramic composites

US Patent 9149904 · Granted Oct 6, 2015

Estimated economic value: $6,400,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Adhesive for processing a microelectronic substrate, and related methods2025
One or more conformal members used in the manufacture of a lapping plate, and re2023
Barrier device used in the manufacture of a lapping plate, and related apparatus2023
Barrier device used in the manufacture of a lapping plate, and related apparatus2023
Barrier device used in the manufacture of a lapping plate, and related apparatus2023
Adhesive for processing a microelectronic substrate, and related methods2023
Method of forming one or more sliders2023
Apparatus for coating a lapping plate platen, and related methods of using2021
Methods of manufacturing one or more sliders, and related sliders2021
One or more conformal members used in the manufacture of a lapping plate, and re2021
Barrier device used in the manufacture of a lapping plate, and related apparatus2020
Barrier device used in the manufacture of a lapping plate, and related apparatus2020