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Home › Bi-modal power delivery scheme for an integrated circuit comprising multiple functional blocks on a single die to achieve desired average throughput for the integrated circuit

Bi-modal power delivery scheme for an integrated circuit comprising multiple functional blocks on a single die to achieve desired average throughput for the integrated circuit

US Patent 9134777 · Granted Sep 15, 2015

Estimated economic value: $4,484,000 ⓘ

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