Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › MEMS device assembly and method of packaging same

MEMS device assembly and method of packaging same

US Patent 9131325 · Granted Sep 8, 2015

Estimated economic value: $6,598,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Liquid cooling system leak detection improvements2025
Stress isolated device package and method of manufacture2024
No-gel pressure sensor package2023
Inertial sensor sampling with combined sense axes2023
No-gel pressure sensor package2022
Z-axis inertial sensor with extended motion stops2022
Inertial sensor with suspension spring structure surrounding anchor2021
Single axis inertial sensor with suppressed parasitic modes2020
Inertial sensor with single proof mass and multiple sense axis capability2020
Flexure with enhanced torsional stiffness and MEMS device incorporating same2020
Pressure sensor having sense elements in multiple wheatstone bridges with chaine2019
Pressure sensor with differential capacitive output2018