Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for manufacturing circuit board having holes to increase resonant frequency of via stubs

Method for manufacturing circuit board having holes to increase resonant frequency of via stubs

US Patent 9119334 · Granted Aug 25, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fiber weave in a printed circuit board substrate2025
Noise cancellation in low-speed signals2025
Signal speed increase in a connector wipe2025
System and method to maintain signal integrity between multiple signal paths con2025
Reflective cancellations in a connector wipe of a surface mount connector2025
Impedance tuning of microstrip traces2025
Systems and methods for testing cabled interconnects under mechanical stress2025
Systems and methods for testing cabled interconnects under mechanical stress2025
On-die termination optimization2025
Reflective cancellations in a connector wipe2025
Printed circuit board with reduced via striping2025
Integrated thermal-electrical co-simulation2025