Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fabrication method of semiconductor package

Fabrication method of semiconductor package

US Patent 9117698 · Granted Aug 25, 2015

Estimated economic value: $3,350,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High-strength multi-functional coating with multi-level structure, and preparati2025
Circuit board structure2025
Illuminated buckle2024
Illuminated buckle2024
Circuit board structure and manufacturing method thereof2024
Buckle device capable of displaying locked state2023
Method of manufacturing memory structure2022
Identity authentication method and apparatus2022
Buckle device2022
Method for fabricating an encapsulated electronic package using a supporting pla2021
Electronic package and method for fabricating the same2021
Electrical testing method of interposer2021