Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectromechanical system package and method of testing

Microelectromechanical system package and method of testing

US Patent 9116165 · Granted Aug 25, 2015

Estimated economic value: $4,442,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stress isolated device package and method of manufacture2024
No-gel pressure sensor package2023
No-gel pressure sensor package2022
Wide input voltage low IQ switching converter2022
Pressure sensor having sense elements in multiple wheatstone bridges with chaine2019
Cycle-by-cycle peak current limiting in current mode buck/boost converters2018
Multi-chip device with temperature control element for temperature calibration2018
Devices and methods for testing integrated circuit devices2017
System and method for monitoring an accelerometer2016
Tester and method for testing a strip of devices2016
Stiction resistant mems device and method of operation2015
Electro-mechanical oscillator and common-mode detection circuit2015