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Home › Method for making an electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board

Method for making an electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board

US Patent 9105819 · Granted Aug 11, 2015

Estimated economic value: $44,934,000 ⓘ

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