Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding

Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding

US Patent 9054115 · Granted Jun 9, 2015

Estimated economic value: $31,100,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Data augmentation for detour path configuring2025
Methods related to dual-sided module with land-grid array (LGA) footprint2025
Systems and methods for tracking a sports object2025
Electronic package and method for manufacturing an electronic package2025
Passive measurement of communication flows2025
Application of conductive via or trench for intra module EMI shielding2025
Application of conductive via or trench for intra module EMI shielding2025
Reconfigurable antenna systems with ground tuning pads2025
Return-link routing in a hybrid network2024
Systems and methods for tracking a sports object2024
Devices and methods related to metallization of ceramic substrates for shielding2024
Selectively shielded radio frequency modules2024