Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermally-conductive particles in printed wiring boards

Thermally-conductive particles in printed wiring boards

US Patent 9049805 · Granted Jun 2, 2015

Estimated economic value: $36,151,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Additive manufacture of complex intermetallic and ceramic structures2025
Tailorable polyorbital-hybrid ceramics2024
Tailorable polyorbital-hybrid ceramics2024
Additive manufacture of complex intermetallic and ceramic structures2024
Direct additive synthesis from UV-induced solvated electrons in feedstock of hal2023
Direct additive synthesis of diamond semiconductor2023
Pin side edge mount connector and systems and methods thereof2022
Direct additive synthesis of diamond semiconductor2021
Direct additive synthesis from UV-induced solvated electrons in feedstock of hal2021
Tailorable polyorbital-hybrid ceramics2020
Two-dimensional graphene cold cathode, anode, and grid2019
3-D diamond printing using a pre-ceramic polymer with a nanoparticle filler2018