Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip scale package with electronic component received in encapsulant, and fabrication method thereof

Chip scale package with electronic component received in encapsulant, and fabrication method thereof

US Patent 9040361 · Granted May 26, 2015

Estimated economic value: $1,580,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power module of electric assisted bicycle2025
Electronic package and fabrication method thereof2024
Speed-command generating unit of electric vehicle, and speed-command generating 2024
Electronic package and fabrication method thereof2023
Electronic package, packaging substrate, and methods for fabricating the same2023
Electronic package and manufacturing method thereof2022
Method of manufacturing memory structure2022
System and method for compensating acceleration of electrical motorbike2022
Method for fabricating carrier-free semiconductor package2022
Method for fabricating carrier-free semiconductor package2022
Electric motor controlling system and vibration suppression method for using the2022
Method for fabricating an encapsulated electronic package using a supporting pla2021