Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for making image sensors using wafer-level processing and associated devices

Method for making image sensors using wafer-level processing and associated devices

US Patent 9013017 · Granted Apr 21, 2015

Estimated economic value: $1,687,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Slanted glass edge for image sensor package2025
Method of manufacturing electronic devices and corresponding electronic device2025
Silicon photonic package and method of fabricating the same2024
Slanted glass edge for image sensor package2024
Thin semiconductor chip using a dummy sidewall layer2022
Device and method for calculating a vehicle trailer pose using a camera2022
Compact microelectronic integrated gas sensor2022
Ambient light sensor with light protection2021
Method, apparatus, and computer readable storage medium for updating electronic 2021
Method, apparatus, and computer readable medium for adjusting color annotation o2021
Method, apparatus, and device for determining lane line on road2021
Method and apparatus for creating map and positioning moving entity2020