Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power management multi-chip module with separate high-side driver integrated circuit die

Power management multi-chip module with separate high-side driver integrated circuit die

US Patent 9000702 · Granted Apr 7, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cement compositions and methods of preparation thereof2025
Noise disturbance rejection for power supply2023
Noise disturbance rejection for power supply2022
Oil-based slurries and methods for making2022
Sulfonated block copolymer laminates with polar or active metal substrates2021
Power management integrated circuit for driving inductive loads2019
Olfactory application controller integrated circuit2017
Method and system for the modular design and layout of integrated circuits2017
AC LED lamp involving an LED string having separately shortable sections2017
Conceptual computation system using a hierarchical network of modules2016
Communicating configuration information across a programmable analog tile to ano2016
Single inductor multiple LED string driver2016