Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device bond pads over process control monitor structures in a semiconductor die

Device bond pads over process control monitor structures in a semiconductor die

US Patent 8994148 · Granted Mar 31, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Offline machine learning for automatic action determination or decision making s2025
Lateral transistor with self-aligned body implant2025
Data schema matching to optimize the quality of applications2024
Lateral transistor with self-aligned body implant2024
Method and system for demand-response signal assignment in power distribution sy2022
Method for training deep neural network (DNN) using auxiliary regression targets2022
Low energy nitrogen removal wetland technology2020
Aerated racetrack wetland system for treating wastewater2020
Wastewater purification device and utilizations2020
Method and system for realizing a geofence scenario with an NGSI-system2019
Method and system for semantically querying a database by a machine-to-machine a2019
Dynamic TCP proxy selection for acceleration of short network flows2019