Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Silver-to-silver bonded IC package having two ceramic substrates exposed on the outside of the package

Silver-to-silver bonded IC package having two ceramic substrates exposed on the outside of the package

US Patent 8987911 · Granted Mar 24, 2015

Estimated economic value: $1,415,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thin profile power semiconductor device package having face-to-face mounted dice2022
Lead and lead frame for power package2020
Thin profile power semiconductor device package having face-to-face mounted dice2020
Lead and lead frame for power package2017
Video and content controlled backlight2016
Photovoltaic cell and E-ink display on the front side of a cell phone case2016
Solderless die attach to a direct bonded aluminum substrate2015
Silver-to-silver bonded IC package having two ceramic substrates exposed on the 2015
Solar cell charger with lens for portable applications2015
Methods and apparatuses for converting carbon dioxide and treating waste materia2015
Lead and lead frame for power package2014
Solderless die attach to a direct bonded aluminum substrate2014