Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for measuring film thickness of SOI layer of SOI wafer

Method for measuring film thickness of SOI layer of SOI wafer

US Patent 8981291 · Granted Mar 17, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for measuring film thickness distribution of wafer with thin films2024
Method for manufacturing an SOI wafer2018
Method for measuring film thickness distribution2016
Method for evaluating thin-film-formed wafer2015
Method for designing SOI wafer and method for manufacturing SOI wafer2014
Method for manufacturing SOI wafer and SOI wafer2013
Inspection method of SOI wafer2012
Method for producing SOI wafer and SOI wafer2007
Method for producing SOI wafer and SOI wafer2005
Method for reclaiming delaminated wafer and reclaimed delaminated wafer2004
Method for reclaiming delaminated wafer and reclaimed delaminated wafer2003
Method for evaluating surface state of silicon wafer1994