Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip-on-wafer structures and methods for forming the same

Chip-on-wafer structures and methods for forming the same

US Patent 8962481 · Granted Feb 24, 2015

Estimated economic value: $4,062,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Using unsupervised clustering and language model to normalize attribute tuples o2025
Integrated circuit package and method2025
Integrated circuit package and method2025
Electronic device and manufacturing method thereof2025
Chip socket, testing fixture and chip testing method thereof2025
Through-circuit Vias in interconnect structures2025
Through-circuit vias in interconnect structures2025
Weakly supervised extraction of attributes from unstructured data to generate tr2025
Signal receiving circuit and noise filtering method thereof2024
Package structure and method of manufacturing the same2024
Package structure and manufacturing method thereof2024
Package structure and method of fabricating the same2024