Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Cleaning composition for temporary wafer bonding materials

Cleaning composition for temporary wafer bonding materials

US Patent 8940104 · Granted Jan 27, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for preparing 7alpha-methyl-19-aldehyde-4-androstene-3,17-dione by electr2023
Superplanarizing spin-on carbon materials2020
HKMG integration2019
Methods for selective etching of a silicon material2019
Polyimides as laser release materials for 3-D IC applications2017
Methods for selective etching of a silicon material2017
Multiple bonding layers for thin-wafer handling2016
Multiple bonding layers for thin-wafer handling2016
Multiple bonding layers for thin-wafer handling2015
Silicone polymers with high refractive indices and extended pot life2015
Piezoelectric sensor based smart-die structure for predicting the onset of failu2014
Acid-etch resistant, protective coatings2014