Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High-throughput assembly of series interconnected solar cells

High-throughput assembly of series interconnected solar cells

US Patent 8927315 · Granted Jan 6, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Roll-to-roll non-vacuum deposition of transparent conductive electrodes2013
Formation of solar cells with conductive barrier layers and foil substrates2013
Optoelectronic architecture having compound conducting substrate2012
Photovoltaic devices with conductive barrier layers and foil substrates2012
Barrier films and high throughput manufacturing processes for photovoltaic devic2012
Individually encapsulated solar cells and solar cell strings2011
Optoelectronic architecture having compound conducting substrate2011
Method of packaging and interconnection of integrated circuits2011
Optoelectronic architecture having compound conducting substrate2011
Method of packaging and interconnection of integrated circuits2011
Optoelectronic architecture having compound conducting substrate2010
Formation of solar cells with conductive barrier layers and foil substrates2010