Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for the placement of electronic components, in particular semi conductor chips on a substrate

Method and apparatus for the placement of electronic components, in particular semi conductor chips on a substrate

US Patent 8914971 · Granted Dec 23, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and device for detaching a component which is attached to a flexible film2011