Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Board-level heat transfer apparatus for communication platforms

Board-level heat transfer apparatus for communication platforms

US Patent 8913391 · Granted Dec 16, 2014

Estimated economic value: $1,564,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of providing user equipment with access to a network and a network config2015
Method of providing user equipment with access to a network and a network config2015
Modular in-frame pumped refrigerant distribution and heat removal system2011
Modular in-frame pumped refrigerant distribution and heat removal system2011
Modular in-frame pumped refrigerant distribution and heat removal system2011
Device packaging and method2003
Temperature compensating device for fiber gratings and a package therefor2000