Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multiple layered head interconnect structure

Multiple layered head interconnect structure

US Patent 8902547 · Granted Dec 2, 2014

Estimated economic value: $24,371,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for content-hashed object storage2023
High flow packaging for slider cleaning2018
Submount assembly integration2015
Capping method for laser diode protection2015
Reusable attachment pads for slider mounting2014
Capping method for laser diode protection2013