Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Modular low stress package technology

Modular low stress package technology

US Patent 8853843 · Granted Oct 7, 2014

Estimated economic value: $1,525,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stress relieved thermal base for integrated circuit packaging2018
Method and system for pre-migration of metal ions in a semiconductor package2015
Modular low stress package technology2014
Modular low stress package technology2014
Modular low stress package technology2013
Method for pre-migration of metal ions in a semiconductor package2013
Modular low stress package technology2013
Modular low stress package technology2012
Modular low stress package technology2012
Semiconductor indicator for voltage diagnostics in power amplifiers2008
Method and structure for improving RF amplifier gain, linearity, and switching s1996
Device for biasing an RF device operating in quasi-linear modes with voltage com1995