Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic assembly with thermally and electrically conductive underfill

Microelectronic assembly with thermally and electrically conductive underfill

US Patent 8847412 · Granted Sep 30, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated cooling assembly with upper and lower channels2025
Embedded organic interposer for high bandwidth2025
Package-on-package assembly with wire bonds to encapsulation surface2025
Metal pads over TSV2025
3D NAND-high aspect ratio strings and channels2025
Bonded structure including an obstructive element directly bonded to a semicondu2025
Protective elements for bonded structures2025
Circuitry for electrical redundancy in bonded structures2025
Stacked devices and methods of fabrication2025
Embedded cooling systems for advanced device packaging and methods of manufactur2025
Stacked devices and methods of fabrication2025
Microelectronic assemblies2025