Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for discretized formation of masking and capping layers on a substrate

Methods for discretized formation of masking and capping layers on a substrate

US Patent 8836123 · Granted Sep 16, 2014

Estimated economic value: $215,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optically bridged multicomponent package with extended temperature range2025
Optically bridged multicomponent package with extended temperature range2025
Optically bridged multicomponent package with extended temperature range2025
Optically bridged multicomponent package with extended temperature range2025
Optically bridged multicomponent package with extended temperature range2025
Optically bridged multicomponent package with extended temperature range2025
Optical multi-die interconnect bridge with electrical and optical interfaces2025
Space configurable battery structures for electrode assemblies incorporating ion2025
Optically bridged multicomponent package with extended temperature range2025
Photonic memory fabric for system memory interconnection2025
Multicomponent photonically intra-die bridged assembly2025
Optical bridging element for separately stacked electrical ICs2025