Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Numerically simulating structural behaviors of embedded bi-materials using meshfree method

Numerically simulating structural behaviors of embedded bi-materials using meshfree method

US Patent 8768660 · Granted Jul 1, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods of simulating drop shock reliability of solder joints with a2024
Systems and methods of simulating drop shock reliability of solder joints with a2023
Meshfree method and system for numerically simulating brittle material based on 2017
Numerical simulation of structural behaviors using a meshfree-enriched finite el2013
Method and system for adaptive mesh-free shell structures2010
Practical fast mesh-free analysis2010
Method and system for mesh-free analysis of general three-dimensional shell stru2009
Method and system for transferring state variables in adaptive mesh-free analysi2008