Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Systems and methods for bonding using microwave energy

Systems and methods for bonding using microwave energy

US Patent 8714225 · Granted May 6, 2014

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Passive mixer in jetting channels of a printhead2025
Active mixer in jetting channels of a printhead2025
Flow-through printhead2025
Nozzle geometry for printheads2024
Nozzle geometry for printheads2021
Nozzle geometry for printheads2020
Systems and methods for bonding materials using microwave energy2011
Systems and methods for bonding semiconductor substrates to metal substrates usi2011
Microwave bonding of MEMS component2005
Microwave bonding of thin film metal coated substrates2004