Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High thermal conductivity materials aligned within resins

High thermal conductivity materials aligned within resins

US Patent 8685534 · Granted Apr 1, 2014

Estimated economic value: $814,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method, device, and system for communicating a changeability attribute2022
Artificial light desaturation process2020
Artificial light color mixing process2020
System for deployment of communication terminals in a cloud computing system2020
Method of updating a location information representing a physical location of a 2019
System for deployment of communication terminals in a cloud computing system2019
Method, device, and system for communicating a changeability attribute2019
Method of updating a location information representing a physical location of a 2019
Artificial light compensation system and process2018
Management of battery capacity2018
Method of updating a location information representing a physical location of a 2018
Method and device capable of unique pattern control of pixel LEDs via smaller nu2018