Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing

Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing

US Patent 8685201 · Granted Apr 1, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wearable, continuous biological fluid monitoring system2025
Origami-based contact members, devices and systems used for active mechanical ha2025
Curved origami-based metamaterial, manufacturing method of the same, curved orig2025
Curved origami-based metamaterials for in situ stiffness manipulation2024
Method and apparatus for capture of a fingerprint using an electro-optical mater2024
Swallowable, food-based, digestible wireless device for measuring gastric pH2023
Mechanical metamaterials as an energy shield2022
Augmented reality scene image processing method and apparatus, electronic device2022
Three-dimensional soft electrode for lithium metal batteries2022
Origami-based collapsible and watertight cases2022
Method for capture of a fingerprint using an electro-optical material2021
Method and apparatus for securing a captured fingerprint2021