Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip package with reinforced positive alignment features

Chip package with reinforced positive alignment features

US Patent 8659161 · Granted Feb 25, 2014

Estimated economic value: $85,045,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

On-chip opto-digital wavelength meter2025
Optically switched network topology2022
Single-pass ring-modulated laser2020
Rapidly tunable silicon modulated laser2020
Method of making an enhanced coupling strength grating having a cover layer2020
Enhanced coupling strength grating having a cover layer2020
Reflow-compatible optical I/O assembly adapter2020
Back-side etching and cleaving of substrates2019
High-power packaged laser array2019
High-power packaged laser array2019
Low-Q inductive-peaking optical front-end2019
Enhanced coupling strength grating having a cover layer2019