Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through-hole-vias in multi-layer printed circuit boards

Through-hole-vias in multi-layer printed circuit boards

US Patent 8658911 · Granted Feb 25, 2014

Estimated economic value: $6,334,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power steering control system with redundant structure and control method thereo2025
Apparatus and method for controlling motor driven power steering system of vehic2025
Method for diagnosing status of motor driven power steering and electronic devic2025
Steering control method of redundant steering system2025
Apparatus for four-wheel independent steering and method of controlling same2025
Emergency steering control apparatus and method of four wheel independent steeri2025
Four-wheel independent steering system and method of controlling the same2024
Merged power delivery2024
Wafer cleaning apparatus and wafer cleaning method using the same2024
Apparatus and method for controlling motor driven power steering system of vehic2024
Steering control apparatus and method in autonomous driving mode2024
Chip-process-variation-aware power-efficiency optimization2024