Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package with multiple dies and bundling of control signals

Integrated circuit package with multiple dies and bundling of control signals

US Patent 8653638 · Granted Feb 18, 2014

Estimated economic value: $3,651,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Mm wave communication mesh network2025
Communication with vehicle based node2023
Communication system supporting communication between end node of a vehicle and 2022
Wireless communication to a vehicle2022
Communication system and method for communication with vehicle based node2022
Wireless communication for vehicle based node2022
Apparatus and method for scheduling communications in a wireless communication s2021
Wireless mesh communications networks2019
Integrated circuit package with multiple dies and queue allocation2016
Integrated circuit package with multiple dies and queue allocation2016
Cache memory system2016
Cache memory system2016