Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ultra-thin quad flat no-lead (QFN) package

Ultra-thin quad flat no-lead (QFN) package

US Patent 8642396 · Granted Feb 4, 2014

Estimated economic value: $6,846,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor packages having an electric device with a recess2020
Semiconductor packages having an electric device with a recess2017
Integrated circuit device with shaped leads and method of forming the device2017
Electronic device with heat dissipater2017
Wafer level chip scale package (WLCSP) having edge protection2017
Integrated circuit (IC) card having an IC module and reduced bond wire stress an2016
Method of making an electronic device including two-step encapsulation and relat2016
Surface mount package for a semiconductor integrated device, related assembly an2016
Methods and devices for packaging integrated circuits2014
Flip-chip fan-out wafer level package for package-on-package applications, and m2014
System in package manufacturing method using wafer-to-wafer bonding2014
Piezo-resistive force sensor with bumps on membrane structure2014