Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

US Patent 8629540 · Granted Jan 14, 2014

Estimated economic value: $7,408,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing spray-dried powders2025
Corroborating device-detected anomalous behavior2025
Continuous manufacturing of spray-dried powders2024
Evaporator system2023
Dual-polarized magneto-electric antenna array2023
Medical device system2023
Wireless communications package with integrated antenna array2023
Leveraging channel diversity in wireless power and communication2022
Compact dipole antenna design2022
Integrated antenna array packaging structures and methods2021
Automatic selection of event video content2021
Predicting outcomes from measures of group cooperation with applications in traf2021